September 13, 2011
Murata Manufacturing Co., Ltd.
President/ Statutory Representative Director: Tsuneo Murata
Overview
Murata Manufacturing Co., Ltd. has developed the world's smallest transmitter module (PAD) integrating a 3G power amplifier*1, coupler*2 and duplexer*3.
Background
Recent years have seen a growing number of frequency bands supporting 3G networks. The more complicated circuit board layouts have made it more difficult to achieve compact design. Murata Manufacturing developed the world's smallest module by integrating the previously separate power amplifier, duplexer and coupler into one unit to meet the need for compact modules that do not require matching*4.
Features
- Supports gain switching*5 (for energy conservation)
- Four types developed to support each single band (B1, B2, B5, B8)
- Enhanced battery usage efficiency with power amplifier efficiency conversion
| HPM (28.25dBm) | 45% |
|---|---|
| MPM (17dBm) | 30% |
| LPM (7dBm) | 18% |
Terminology
| *1 Power amplifier: | A semiconductor that amplifies a high-frequency signal in a mobile phone, etc. when that signal is transmitted |
|---|---|
| *2 Coupler: | An element that detects output of an electrical signal |
| *3 Duplexer: | A component that simultaneously filters transmitted signals (from transmitter circuit to antenna circuit) and received signals (from antenna circuit to receiving circuit) of different frequency bands. It also prevents the transmitter circuit signal from going around to the receiving circuit. |
| *4 Matching: | A djusting the transmission of electrical signals between elements |
| *5 Gain: | A function for adjusting the volume of radio waves. For example, one can save energy by lowering the volume of radio waves in places where the state of such waves is unfavorable. |
Applications
Mobile phones, smartphones
Part Number
- HFQPFEHBA-128TEMP (Supports Band1)
- HFQPFEHBA-129TEMP (Supports Band2)
- HFQPFEHBA-130TEMP (Supports Band5)
- HFQPFEHBA-131TEMP (Supports Band8)
External Size
4.3mm x 3.4mm x 1.0mm (Max)
Production
Mass production to begin in December 2011 at Komatsu Murata Manufacturing Co., Ltd.
Sample Price
300 yen per unit
Patenting Information
Five patent applications have been submitted
Future Development
Murata Manufacturing is considering an even
smaller size for the next module to meet market needs for compact
components.
We are also working on a dual band version.
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