Taiwan is now the world leader in IC manufacturing capacity, according to IC Insights, with 21% of worldwide capacity.
Japan is in second place with 19.7% followed by Korea with 16.8%. Fourth is America with 14.7% and fifth is China with 8.9%%. Europe trails a lowly sixth with 8.1% while RoW, consisting primarily of Singapore, Israel, Malaysia, but also including Russia, Belarus, India, South Africa, and Australia, comes in at 10.8%.
Taiwan also has the industry's largest share of capacity for 300mm wafers with a 25.4% share of worldwide 300mm wafer capacity, 18.7% of 200mm wafer capacity, and 11.4% of 150mm wafer capacity.
In 2011, 300mm wafers represented 64.6% of the country's installed capacity, 200mm wafers, 29.2%; and 150mm wafers accounted for 6.1%.
Taiwan also holds the industry’s largest share of capacity dedicated to "not so leading-edge" 40nm-60nm process geometries. This is to be expected, given Taiwan's focus on providing foundry services to a large variety of fabless IC suppliers, fab-lite IDMs, and electronic system producers.
