November 03, 2011 | Julien Happich | 222909879
Microsemi Corporation announced a DDR3 SDRAM memory device that the company believes is the first of its kind to be packaged in a single plastic ball grid array (PBGA) and offered as a 23x32mm x64/x72 unregistered dual in-line memory module (UDIMM )/small outline dual in-line memory module (SODIMM). The solution provides up to 4GByte compact memory densities that support high-performance processors and chipsets in mission-critical applications such as avionics and other applications that require high reliability in harsh environments.
The company's commercial off-the-shelf (COTS) DDR3 SDRAM devices give customers a standalone, high-density memory solution that also meets the data widths necessary for many applications. The DDR3 devices significantly reduce space requirements as compared to systems built from discrete memory components, and also use less board space than memory solutions using chip scale packages (CSPs) and other single-die solutions. The device supports data rates of 800, 1,066 and 1,333Mbit/s and operates on a 1.5 volt power supply. Other features include address, command and clock terminations, RZQ calibration resistors and built-in decoupling.
Visit Microsemi at www.microsemi.com
