X-FAB’s 0.18 micron mixed signal/high voltage/embedded flash process is available for tape-ins, including pre-released IP for the memory options. Full qualification will follow in 2012.
“The industry is very engaged in developing energy-efficient chips and systems,” explains X-FAB CEO Rudi de Winter, “XP018 technology is a cost-effective way to design smart systems-on-chip that combine the 60V capability with flash-based embedded microcontrollers for the next generation of power management applications.”
The process is claimed to have the industry’s lowest mask count for the modular combination of digital, analogue and high-voltage with embedded Flash.
It allows SOCs requiring up to 60V operating voltage and 5V power supply to be combined with embedded non-volatile memory (NVM).
The process comes with operating voltages ranging from 5V to 60V, and a competitive RDSon to enable small chip sizes and lower costs.
Its combination of high voltage and embedded non-volatile memory requires fewer than 30 masks – the lowest mask count in the foundry industry for these features. The process is also well suited for automotive applications.
The process topology comes with a range of NVM options including poly fuse, OTP, EEPROM and Flash, all of which will be available in 2012 for fully qualified PDK support.
