“Our customers are seeking ways to design more reliable and efficient SOCs for their automotive, power management and NVM embedded applications,” explained Thomas Ramsch, Director Design Support at X-FAB. “After extensive evaluations, we decided to start using Silicon Frontline’s R3D software for our XH018 process. R3D enhances our customers’ SOC design quality and time to market with its powerful analysis and visualization of current density, potential distribution and IR drop. Therefore, we will offer XH018 Pcells for driver integration as part of our PDK by early March, giving customers a way to check their layout, optimize RDSon and do reliability checks.”
X-FAB manufactures wafers for automotive, industrial, consumer, medical, and other applications on modular CMOS and BiCMOS processes in geometries ranging from 1.0 to 0.13 micrometers, and offers special BCD, SOI and MEMS long-lifetime processes.
Visit Silicon Frontline at www.siliconfrontline.com
