Movidius is working with Toshiba to develop a complete 3D camera system for smartphones.
The firm's MA1178 video processor chip has been combined with Toshiba’s 8 Megapixel extended depth of field cameras in a 3D camera module for smartphones.
The use of extended depth of field (EDOF) cameras removes the need for autofocus which helps 3D synchronisation.
According to Shiro Ando, v-p, Toshiba Electronics Europe, the combination enables mobile handset makers "to meet consumer demand for a superior 3D mobile experience. Simultaneously, they simplify the manufacturing process by rectifying distortion."
"The team at Movidius is very excited to be partnering with Toshiba to develop this leading 3D solution," commented Sean Mitchell, CEO of Movidius.
There is also the flexibility to implement a symmetric or asymmetric set up of either two 8 Megapixel EDOF cameras or a combination of 8 and 3 Megapixel EDOF cameras.
Movidius will demonstrate its MA1178 product together with the 3D system solution at the MWC 2012 in Barcelona later this month.
